Choose a different country or region to view content for your location

WIDOPAN-Chips

WIDOPAN-Chips

Application

The chips are scattered into the wet WIDOCRYL-Topsiegel either by hand or using a special device with compressed air. At a full surface scattering the surface must be sealed subsequently with WIDOCRYL-Sealing PM.

Before processing it needs to be checked that the chips are compatible with the carrier resin to make sure that there will be no side reactions.

Please also refer to further product information of the system components, layer strutures and technical information.

Download pdf